Cypress enCoRe CY7C63310 Manual do Utilizador descarregar pdf (Página 77)

CY7C63310, CY7C638xx

Document 38-08035 Rev. *K Page 77 of 83

Figure 31-3. 18-Pin (300-Mil) Molded DIP P3

Figure 31-4. 18-Pin (300-Mil) Molded SOIC S3

DIMENSIONS IN INCHES

MIN.

MAX.

SEATING PLANE

0.240

0.270

0.030

0.060

0.870

0.920

0.140

0.190

0.090

0.110

0.055

0.065

0.015

0.020

0.120

0.140

0.015

0.060

0.009

0.012

0.310

0.385

0.300

0.325

0.115

0.160

3° MIN.

10 18

PART #

LEAD FREE PKG.

STANDARD PKG.

PZ18.3

P18.3

51-85010 *B

PIN 1 ID

SEATING PLANE

0.447[11.353]

0.463[11.760]

10 18

DIMENSIONS IN INCHES[MM]

MIN.

MAX.

0.291[7.391]

0.300[7.620]

0.394[10.007]

0.419[10.642]

0.050[1.270]

TYP.

0.092[2.336]

0.105[2.667]

0.004[0.101]

0.0118[0.299]

0.0091[0.231]

0.0125[0.317]

0.015[0.381]

0.050[1.270]

0.013[0.330]

0.019[0.482]

0.026[0.660]

0.032[0.812]

0.004[0.101]

REFERENCE JEDEC MO-119

PART #

S18.3 STANDARD PKG.

SZ18.3 LEAD FREE PKG.

51-85023-*B

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