Cypress CY7C185 Manual do Utilizador

Consulte online ou descarregue Manual do Utilizador para não Cypress CY7C185. Cypress CY7C185 User's Manual Manual do Utilizador

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8K x 8 Static RAM
f
ax
id
:
1013
CY7C185
Cypress Semiconductor Corporation
3901 North First Street San Jose CA 95134 408-943-2600
Au
g
ust 12
,
1998
Features
High speed
—15 ns
Fast t
DOE
Low active power
—715 mW
Low standby power
—220 mW
CMOS for optimum speed/power
Easy memory expansion with CE
1
, CE
2
, and OE features
TTL-compatible inputs and outputs
Automatic power-down when deselected
Functional Description
The CY7C185 is a high-performance CMOS static RAM orga-
nized as 8192 words by 8 bits. Easy memory expansion is
provided by an active LOW chip enable (CE
1
), an active HIGH
chip enable (CE
2
), and active LOW output enable (OE) and
three-state drivers. This device has an automatic power-down
feature (CE
1
or CE
2
), reducing the power consumption by 70%
when deselected. The CY7C185 is in a standard 300-mil-wide
DIP, SOJ, or SOIC package.
An active LOW write enable signal (WE
) controls the writ-
ing/reading operation of the memory. When CE
1
and WE in-
puts are both LOW and CE
2
is HIGH, data on the eight data
input/output pins (I/O
0
through I/O
7
) is written into the memory
location addressed by the address present on the address
pins (A
0
through A
12
). Reading the device is accomplished by
selecting the device and enabling the outputs, CE
1
and OE
active LOW, CE
2
active HIGH, while WE remains inactive or
HIGH. Under these conditions, the contents of the location ad-
dressed by the information on address pins are present on the
eight data input/output pins.
The input/output pins remain in a high-impedance state unless
the chip is selected, outputs are enabled, and write enable
(WE
) is HIGH. A die coat is used to insure alpha immunity.
Logic Block Diagram Pin Configurations
C185–1
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
0
A
10
A
9
A
11
A
12
I/O
0
C185–2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
WE
CE
2
A
3
A
2
A
1
OE
A
0
CE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
NC
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
I/O
0
I/O
1
I/O
2
GND
256 x 32 x 8
ARRAY
INPUT BUFFER
COLUMN DECODER
ROW DECODER
SENSE AMPS
POWER
DOWN
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
CE
1
CE
2
WE
OE
Top View
DIP/SOJ/SOIC
Selection Guide
[1]
7C185–15 7C185–20 7C185–25 7C185–35
Maximum Access Time (ns) 15 20 25 35
Maximum Operating Current (mA) 130 110 100 100
Maximum Standby Current (mA) 40/15 20/15 20/15 20/15
Note:
1. For military specifications, see the CY7C185A datasheet.
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Resumo do Conteúdo

Página 1 - 8K x 8 Static RAM

8K x 8 Static RAMfax id: 1013CY7C185 Cypress Semiconductor Corporation• 3901 North First Street • San Jose • CA 95134 • 408-943-2600August 12, 1998Fea

Página 2 - Electrical Characteristics

CY7C185© Cypress Semiconductor Corporation, 1998. The information contained herein is subject to change without notice. Cypress Semiconductor Corporat

Página 3 - AC Test Loads and Waveforms

CY7C1852Maximum Ratings(Above which the useful life may be impaired. For user guide-lines, not tested.)Storage Temperature ...

Página 4 - Switching Characteristics

CY7C1853Electrical Characteristics Over the Operating Range (continued)7C185–25 7C185-35Parameter Description Test Conditions Min. Max. Min. Max. Unit

Página 5 - Switching Waveforms

CY7C1854Switching Characteristics Over the Operating Range[5]7C185–15 7C185–20 7C185–25 7C185–35Parameter Description Min. Max. Min. Max. Min. Max. Mi

Página 6

CY7C1855Switching Waveforms9. Device is continuously selected. OE, CE1 = VIL. CE2 = VIH.10. WE is HIGH for read cycle.11. Data I/O is High Z if OE = V

Página 7

CY7C1856Notes:14. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.15. If CE1 goes HIGH or CE2 goes

Página 8 - Ordering Information

CY7C1857Typical DC and AC Characteristics–55 25 1251.21.00.8OUTPUT SOURCE CURRENT (mA)AMBIENT TEMPERATURE (°C)0.60.40.20.0NORMALIZED I , ICCISBVCC

Página 9

CY7C1858Document #: 38–00037–KTruth TableCE1CE2WE OE Input/Output ModeH X X X High Z Deselect/Power-DownX L X X High Z Deselect/Power-DownL H H L Dat

Página 10 - Package Diagrams

CY7C1859Package Diagrams51-85014-B28-Lead (300-Mil) Molded DIP P2128-Lead (300-Mil) Molded SOIC S2151-85026-A

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